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| Ev Archive for November 1997 |
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| 1037 messages, last added Wed Aug 08 18:41:03 2001 |
[Date Index][Thread Index]
Re: To Goo, or Not to Goo - soldering?
The data Bill provided seems pretty conclusive.
Here's my question. Could one decrease the limitations of the
hammer crimper by heating the crimp and wicking in solder? I doubt you
could ever completely achieve as conductive a connection as a really
good crimp. You're trading a Cu/Pb,Sn/Cu interface for what would
otherwise be a high pressure Cu/Cu interface.
On the otherhand, the solder join probably has a greater surface area
then you could ever hope for with even a hex a crimper.
Does anybody have data on this?
Peter
Re: To Goo, or Not to Goo - soldering?
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